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Studies on via coupling on multilayer printed circuit boards
URI:
http://urn.fi/URN:NBN:fi:bib:me:W00260041500
author
Tarvainen, Timo
inLanguage
en
isPartOf
Fennica
name
Studies on via coupling on multilayer printed circuit boards
P60049
<http://rdaregistry.info/termList/RDAContentType/1020>
Instances
1999 : Oulun yliopisto
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Studies on via coupling on multilayer printed circuit boards
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00260041500
datePublished
1999
description
kuvitettu
identifier
propertyID:
FI-FENNI
value:
629820
propertyID:
FI-MELINDA
value:
002600415
propertyID:
skl
value:
fx629820
isbn
9514251881
isPartOf
Acta Univesitatis Ouluensis. D, Medica
Fennica
name
Studies on via coupling on multilayer printed circuit boards
numberOfPages
87 s.
P60048
<http://rdaregistry.info/termList/RDACarrierType/1049>
P60050
<http://rdaregistry.info/termList/RDAMediaType/1007>
publication
location:
Oulu
organizer:
Oulun yliopisto
publisher
Oulun yliopisto
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