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Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
URI:
http://urn.fi/URN:NBN:fi:bib:me:W00591499400
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matemaattiset menetelmät
Monte Carlo -menetelmät
author
Li, Jue
inLanguage
en
isPartOf
Fennica
name
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
P60049
<http://rdaregistry.info/termList/RDAContentType/1020>
Instances
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-, e-book
2011 : Aalto-yliopisto
2011 : Aalto-yliopisto, e-book
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00594714802
isbn
9789526041469
isPartOf
Acta Wasaensia. Viestintätieteet
Fennica
name
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00591499402
isbn
9789526041476
isPartOf
Acta Wasaensia. Viestintätieteet
Fennica
name
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00594714801
description
Julkaistu myös painettuna
isPartOf
Acta Wasaensia. Viestintätieteet
Fennica
name
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00591499401
description
Yhteenveto-osa julkaistu myös verkkoaineistona
isPartOf
Acta Wasaensia. Viestintätieteet
Fennica
name
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00591499403
bookFormat
<http://schema.org/EBook>
isPartOf
Acta Wasaensia. Viestintätieteet
Fennica
name
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
url
<http://urn.fi/URN:ISBN:978-952-60-4147-6>
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Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00591499400
datePublished
2011
description
Artikkeliväitöskirjan yhteenveto-osa ja 6 eripainosta.
kuvitettu
identifier
propertyID:
FI-FENNI
value:
981236
propertyID:
FI-MELINDA
value:
005914994
propertyID:
skl
value:
fx981236
isbn
9789526041469
isPartOf
Acta Wasaensia. Viestintätieteet
Fennica
name
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
numberOfPages
52, [59] sivu
P60048
<http://rdaregistry.info/termList/RDACarrierType/1049>
P60050
<http://rdaregistry.info/termList/RDAMediaType/1007>
publication
location:
Espoo
organizer:
Aalto-yliopisto
publisher
Aalto-yliopisto
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00594714800
bookFormat
<http://schema.org/EBook>
datePublished
2011
description
Artikkeliväitöskirjan yhteenveto-osa.
Nimeke nimiösivulta.
identifier
propertyID:
FI-MELINDA
value:
005947148
isbn
9789526041476
isPartOf
Acta Wasaensia. Viestintätieteet
Fennica
name
Numerical simulations for reliability assessment of lead-free solder interconnections in BGA packages
numberOfPages
1 verkkoaineisto (55 s.)
P60048
<http://rdaregistry.info/termList/RDACarrierType/1018>
P60050
<http://rdaregistry.info/termList/RDAMediaType/1003>
publication
location:
Espoo
organizer:
Aalto-yliopisto
publisher
Aalto-yliopisto
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