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Mechanical properties of solder joints and optimization of soldering process yield using Sn/Ag/Cu alloys
URI:
http://urn.fi/URN:NBN:fi:bib:me:W00508449700
author
Arra, Minna
inLanguage
en
isPartOf
Fennica
name
Mechanical properties of solder joints and optimization of soldering process yield using Sn/Ag/Cu alloys
P60049
<http://rdaregistry.info/termList/RDAContentType/1020>
Instances
2004 : Tampereen teknillinen yliopisto. Optoelektroniikan tutkimuskeskus
View this in Finna
Mechanical properties of solder joints and optimization of soldering process yield using Sn/Ag/Cu alloys
URI:
http://urn.fi/URN:NBN:fi:bib:me:I00508449700
datePublished
2004
description
kuvitettu
Tiivistelmä ja 6 erip.
identifier
propertyID:
FI-FENNI
value:
781197
propertyID:
FI-MELINDA
value:
005084497
propertyID:
skl
value:
fx781197
isbn
9521511451
isPartOf
Fennica
Julkaisuja / Helsingin yliopisto, maaseudun tutkimus- ja koulutuskeskus
name
Mechanical properties of solder joints and optimization of soldering process yield using Sn/Ag/Cu alloys
numberOfPages
x, 58, [89]
P60048
<http://rdaregistry.info/termList/RDACarrierType/1049>
P60050
<http://rdaregistry.info/termList/RDAMediaType/1007>
publication
location:
Tampere
organizer:
Tampereen teknillinen korkeakoulu Tampereen teknillinen yliopisto. Optoelektroniikan tutkimuskeskus
publisher
Tampereen teknillinen korkeakoulu
Tampereen teknillinen yliopisto. Optoelektroniikan tutkimuskeskus
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