Use of microcutting for high throughput electrode patterning on a flexible substrate
Janka, M.; Tuukkanen, S.; Tuorila, H.; Viheriälä, J.; Honkanen, M.; Stingelin, N.; Lupo, D. (2014-01)
Janka, M.
Tuukkanen, S.
Tuorila, H.
Viheriälä, J.
Honkanen, M.
Stingelin, N.
Lupo, D.
01 / 2014
015015
Julkaisun pysyvä osoite on
https://urn.fi/URN:NBN:fi:tty-201603183664
https://urn.fi/URN:NBN:fi:tty-201603183664
Kuvaus
Peer reviewed
Tiivistelmä
The use of printing technologies is promising for low-cost manufacturing of flexible, light-weight and large-area electronics, such as electronic paper or solar cells. Here, we demonstrate a microcutting technique and methods to fabricate cutting blades for the patterning of metal structure on a polymer substrate. Microcutting is done using a hot embossing and nanoimprinting techniques. The metallic fine patterns obtained by using stamps fabricated using different techniques are compared. Combination of microcutting and our recently proposed dielectric alignment opens up a novel platform for a variety of applications, such as the fabrication of metal crossover or organic field effect transistors as well as contact resistance measurement of metal-semiconductor junctions.
Kokoelmat
- TUNICRIS-julkaisut [17066]