The Effects of Additives on the Electrodeposition of Copper Studied by Impedance Technigue

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Journal ISSN
Volume Title
Helsinki University of Technology | Licentiate thesis
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Date
1984
Department
Major/Subject
Fysikaalinen kemia
Mcode
5.31
Degree programme
Language
en
Pages
44 s. + liitt. 35
Series
Description
Supervisor
Sundholm, Göran
Keywords
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Citation